One Layer Single Sided PCB Circuit Boards With High Frequency Laminate
Quick detail:
| |
|
| Layer |
Single Layer |
| Material |
FR4 |
| Board Thinckness |
1.2MM |
| Size |
12*9CM |
| Solder Mask |
Green |
| Silkscreen |
White |
| Finish Copper Thinckness |
35μm/35μm |
| Surface Finish |
HASL |
| Board Thinckness Tolerance |
±10% |
| Impedance Control |
±10% |
| Warp & Wist |
0.70% |
| Testing |
100% Electric Test, IPC Class II. |
Specification:
1 Layer Black Soldermask Immersion Gold High TG PCB Board In Panel Format
FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.
Defined impedance 4 layer black soldermask immersion gold board is: a good laminated structure will be able to play on the printed circuit board characteristic impedance control, the traces can be formed easily controlled and predictable transmission line structure is called impedance plate.
Current common characteristic impedance is divided into: single-ended (line) impedance differential (fixed) impedance coplanar impedance.
Single-ended (wire) Impedance: English single ended impedance, refers to a single signal line measured impedance.
Difference (Fixed) Impedance: English differential impedance, differential drive means to the test in two monospaced equally spaced transmission line impedance.
Products Details
| Raw Material |
FR-4 (Tg 130 available) |
| Layer Count |
Single Sided |
| Board Thickness |
1.2mm |
| Copper Thickness |
1.0oz |
| Surface Finish |
ENIG(Electroless Nickel Immersion Gold) |
| Solder Mask |
Green |
| Silkscreen |
White |
| Min. Trace Width/Spacing |
0.075/0.075mm |
| Min. Hole Size |
0.25mm |
| Hole Wall Copper Thickness |
≥20μm |
| Measurement |
300×400mm |
| Packaging |
Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps |
| Application |
Communication,automobile,cell,computer,medical |
| Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| XCE PCB technical specification |
| Annual stock meterial |
Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free |
| Layer No. |
1-16 |
| Min board thickness |
2 layer 0.2mm |
| 4 layer 0.4mm |
| 6 layer 0.6mm |
| 8 layer 0.8mm |
| 10 layer 1.0mm |
| Max panel size |
508*610mm |
| Board thickness tolerance |
T≥0.8mm±8%,T＜0.8mm±5% |
| Wall hole copper thickness |
＞0.025mm(1mil) |
| Finished hole |
0.2mm-6.3mm |
| Min line width |
4mil/4mil(0.1/0.1mm) |
| Min bonding pad space |
0.1mm(4mil) |
| PTH aperture tolerance |
±0.075mm(3mil) |
| NPTH aperture tolerance |
±0.05mm(2mil) |
| Hole site deviation |
±0.05mm(2mil) |
| Profile tolerance |
±0.10mm(4mil) |
| Board bend&warp |
≤0.7% |
| Insulation resistance |
＞1012Ωnormal |
| Through-hole resistance |
＜300Ωnormal |
| Electric strength |
＞1.3kv/mm |
| Current breakdown |
10A |
| Peel strength |
1.4N/mm |
| Soldmask regidity |
＞6H |
| Thermal stress |
288℃20Sec |
| Testing voltage |
50-300v |
| Min buried blind via |
0.2mm(8mil) |
| Outer cooper thickness |
1oz-5oz |
| Inner cooper thickness |
1/2 oz-4oz |
| Aspect ratio |
8:1 |
| SMT min green oil width |
0.08mm |
| Min green oil open window |
0.05mm |
| Insulation layer thickness |
0.075mm-5mm |
| Aperture |
0.2mm-0.6mm |
| Special technology |
Inpedance,blind buried via,thick gold,aluminumPCB |
| Surface finish |
HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating |
Product Tags:
|
|
One Layer Single Sided PCB Circuit Boards With High Frequency Laminate Images
|
