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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Custom PCB Circuit Boards For Wireless 5G Mobile Communication Devices

Shenzhen Xinchenger Electronic Co.,Ltd
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Custom PCB Circuit Boards For Wireless 5G Mobile Communication Devices

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Brand Name : XCE

Model Number : XCER

Certification : CE,FCC,UL,SGS

Place of Origin : China

MOQ : 1 pcs

Price : USD

Supply Ability : 100000000pcs/week

Delivery Time : 3-8 days

Packaging Details : inner:bubble bag outer: carton box

Material : Risho

Color : Green

Size : 5*3cm

Board thickness : Mechanical drill: 8mil(0.2mm)

Copper weight : Inner 1/2 oz-4oz;Outer 1oz-5oz

Min. Line Width : 3mil

Surface technology : Immersion gold

Thickness : 0.8mm

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Risho Material Custom PCB Circuit Boards For Wireless 5G Mobile Communication Devices

Quick Details

Model Number: XCER
Number of Layers: 2-Layer
Base Material: Risho
Copper Thickness: Inner 1/2 oz-4oz;Outer 1oz-5oz
Board Thickness: 0.8mm
Min. Hole Size: 0.2mm-6.3mm
Min. Line Width: 3MIL
Min. Line Spacing: 3mil
Surface Finishing: Immersion
Color: Green
Service: One-stop Service
Certificate: ISO9001,SGS,UL
Name: High frequency pcb
Testing Service: standard
Type: Panel
Shipping: Buyer's Requirement

PCB Introduction

1, Surface finish: Immersion Gold/HALS/OSP/Gold finger/Carbon print/Peelable mask/Blue mask/Plating gold

2, Solder mask colour: green/white/yellow/blue/red/black
3, Silk screen: white/black/yellow/red/blue/green

4, Applied in industrial facilities/medical facilities/consumer electronics/telecommunications/power supply


Technology parameter:

Layer

2 layer

Material type

Risho

Board thickness

0.8mm

Copper thickness

0.5OZ

Copper thickness in hole

>25.0 um (>1mil)


Size

Max. Board Size: 23 × 25 (580mm×900mm)

Min. Drilled Hole Size: 3mil (0.075mm)

Min. Line Width: 3mil (0.075mm)

Min. Line Spacing: 3mil (0.075mm)


Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating


Tolerance

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling

Any other special material please feel free to let us know



PCB Technical Specification

Number of Layer 1,2,4 or 6,upto 24 layer
Order Quantity 1 to 50,0000
Board Shape Retangular,round,slots,cutouts,complex,irregular
Board Type Rigid, Flexible, Rigid-flexible
Board Material FR-4 glass epoxy, FR-4 high Tg, Rohs compliant,Aluminum,Rogers,etc.
Board Cutting Shear,V-score,Tab-routed
Board Thickness 0.2-4.0mm, Flex 0.01-0.25mm
Copper Weight 1.0, 1.5, 2.0 oz
Solder Mask Double-sided green LPI,Also support Red,White,Yellow,Blue,Black
Silk Screen Double-sided or single-sided in white,yellow,black,or negative
Silk Screen Min Line Width 0.006'' or 0.15mm
Max Board Dimensions 20 inch*20inch or 500mm*500mm
Min Trace/Gap 0.10mm, or 3mils
Min Drill Hole Diameter 0.01'',0.25mm, or 10mils
Surface Finish HASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc.
Board Thickness Tolerance ±10%
Copper Weight Tolerance ± 0.25 oz
Minimal Slot Width 0.12'', 3.0mm, or 120mils
V-Score Depth 20-25% of board thickness
Design File Formate Gerber RS-274,274D,Eagle and AutoCAD's DXF,DWG


Custom PCB Circuit Boards For Wireless 5G Mobile Communication Devices

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