Mixed Compression Rogers 4003 C High Frequency PCB With UL ENIG Surface Finish
Quick Detail :
1. Type : Pcb
2. Material : Rogers+ Fr4
3. Layer : Multilayer
4. Products Size :11*5cm
5. Permittivity : 2.5
6. Surface finish : ENIG
Features:
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
Parameter:
| Model |
Parameter |
thickness(mm) |
Permittivity(ER) |
| F4B |
F4B |
0.38 |
2.2 |
| F4B |
0.55 |
2.23 |
| F4B |
0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 |
2.65 |
| F4Bk |
0.8,1.5 |
2.65 |
| F4B |
0.8 |
3.5 |
| FE=F4BM |
1 |
2.2 |
| Rogers |
RO5880 |
0.254 0.508 0.762 |
2.20 ± 0.02 |
| RO4350 |
0.254 0.508,0.8,1.524 |
3.5 |
| RO4003 |
0.508 |
3.38 |
| TACONIC |
TLF-35 |
0.8 |
3.5 |
| TLA-6 |
0.254,0.8,1,1.5, |
2.65 |
| TLX-8 |
0.254,0.8,1,1.6 |
2.55 |
| RF-60A |
0.64 |
6.15 |
| TLY-5 |
0.254,0.508,0.8 |
2.2 |
| TLC-32 |
0.8,1.5,3 |
3.2 |
| TLA-35 |
0.8 |
3.2 |
| ARLON |
AD255C06099C |
1.5 |
2.55 |
| MCG0300CG |
0.8 |
3.7 |
| AD0300C |
0.8 |
3 |
| AD255C03099C |
0.8 |
2.55 |
| AD255C04099C |
1 |
2.55 |
| DLC220 |
1 |
2.2 |
Description :
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Data :
| Layer |
1 to 28 layers |
| Material type |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| Board thickness |
0.21mm to 7.0mm |
| Copper thickness |
0.5 OZ to 7.0 OZ |
| Copper thickness in hole |
>25.0 um (>1mil) |
|
Size
|
Max. Board Size: 23 × 25 (580mm×900mm) |
| Min. Drilled Hole Size: 3mil (0.075mm) |
| Min. Line Width: 3mil (0.075mm) |
| Min. Line Spacing: 3mil (0.075mm) |
|
Surface finishing
|
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
|
Tolerance
|
Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
| Certificate |
UL, ISO 9001, ISO 14001 |
| Special requirements |
Buried and blind vias+controlled impedance +BGA |
| Profiling |
Punching, Routing, V-CUT, Beveling |
|
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
|
Benefits:
• High Glass Transition Temperature (Tg) (150Tg or 170Tg)
• High Decomposition Temperature (Td) (> 325º C)
• Low Coefficient of Thermal Expansion (CTE) ((3.0%-3.8%)
• Dielectric Constant (@1 GHz): 4.25-4.55
• Dissipation Factor (@ 1 GHz): 0.016
• UL rated (94V-0, CTI = 4)
• Compatible with standard and lead-free assembly.
• Laminate thickness available from 0.005” to 0.125”
• Pre-preg thicknesses available (approximate after lamination):
(1080 glass style) 0.0022”
(2116 glass style) 0.0042”
(7628 glass style) 0.0075”
Typical Applications:
- Phase Array Antennas
- High Reliability Complex Multilayer Circuits
- Ground Based and Airborne Radar Systems
- Commercial Airline Collision Avoidance Systems
- Global Positioning System Antennas
- Beam Forming Networks
-
Production Description :
| Parameter |
Value |
| Specific gravity/density |
1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption |
−0.125 in < 0.10% |
| Temperature index |
140 °C (284 °F) |
| Thermal conductivity, through-plane |
0.29 W/(m·K),[1] 0.343 W/(m·K)[2] |
| Thermal conductivity, in-plane |
0.81 W/(m·K),[1] 1.059 W/(m·K)[2] |
| Rockwell hardness |
110 M scale |
| Bond strength |
> 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW |
> 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW |
> 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW |
> 310 MPa (45,000 psi) |
| Izod impact strength - LW |
> 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW |
> 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise |
> 415 MPa (60,200 psi) |
| Dielectric breakdown (A) |
> 50 kV |
| Dielectric breakdown (D48/50) |
> 50 kV |
| Dielectric strength |
20 MV/m |
| Relative permittivity (A) |
4.8 |
| Relative permittivity (D24/23) |
4.8 |
| Dissipation factor (A) |
0.017 |
| Dissipation factor (D24/23) |
0.018 |
| Dielectric constant permittivity |
4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature |
Can vary, but is over 120 °C |
| Young's modulus - LW |
3.5×106 psi (24 GPa) |
| Young's modulus - CW |
3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis |
1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis |
1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis |
7.0×10−5 K−1 |
| Poisson's ratio - LW |
0.136 |
| Poisson's ratio - CW |
0.118 |
| LW sound speed |
3602 m/s |
| SW sound speed |
3369 m/s |
|
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Product Tags:
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Mixed Compression Rogers 4003 C High Frequency PCB With UL ENIG Surface Finish Images
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