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Brand Name : XCEPCB
Model Number : XCEPCBR
Certification : CE,FCC,ISO9008,SGS,UL
Place of Origin : CHINA
MOQ : 1pcs
Price : USD 0.1-10
Payment Terms : Western Union,, T/T
Supply Ability : 1000000PCS/per week
Delivery Time : 3-12 days
Packaging Details : Inner:Vacuum packed bubble bag Outer:Carton box / mentioned is standard packing method,unless otherwise specified.
Material : FR4 PCB
Color : GREEN
Size : 13*13cm
Surface : HASL
Board THK : 1.6mm
Copper THK : 1OZ
High Quality FR4 Multilayer PCB For Air Condition Controller Manufacturer
  
1.1L aluminum PCB; 
 2.good quality,reasonable price; 
 3.quicker delivery; 
 4.better logistic service; 
 5.UL,SGS,ROHS,ISO9000
  
 -- PCB Manufacturing Services
     High quality PCB manufacturing
      Military, space and commercial applications
      Wide array of substrates
      Small prototype runs
      Large scale production runs
      ENIG, Immersion Silver, Lead Free HASL
      Edge plating, plated slots
      Blind / Buried vias
      Fast turn times
      reasonable prices!
-- Good Quality: UL, SGS Test, RoHS Certification
 -- 1-20 layer: FR-4 matirial
 -- Lead time: 3-12 days
 -- competitive Price
| Item | Specification | ||
| Material | FR-4 / Hi-Tg FR-4 / Lead free Materials(RoHS Compliant)/CEM-3/CEM-1/Aluminium | ||
| Layer | single layer,double layer,multi-layer(4-10) | ||
| Board Thickness | 0.3mm-3.0mm,+/-0.1mm(tolerance) | ||
| Copper Thickness | 1/2OZ-3OZ (35um to 105um),+/-8um(tolerance),purity 99.5% | ||
| Impedance Control | ±10% | ||
| Bow and Twist MAX. | 0.75%(SMT) | ||
| Anti-strip | 0.88N/mm | ||
| Resistance | ≤20Ω | ||
| Reactance | 500V | ||
| Min. Value | |||
| Min. Trace/Space Width | 6 mil,+/-0.15mm(tolerance) | ||
| SMD Pitch | 10 mil | ||
| BGA Pitch | 20 mil | ||
| Min Pad Space | 4mil(SMT) | ||
| Plating Copper Thickness | 15um | ||
| Hole | |||
| Hole Size | 0.25mm--6.2mm | ||
| Hole Position Tolerance | ±0.1mm | ||
| PTH/NPTH Tolerance | ±0.15mm(dia.=0.4-1.4mm) | ||
| Pad Tolerance | ±0.1mm(dia.≥0.6mm) | ||
| Pad to hole/to pad Tolerance | ±0.05mm/±0.2mm | ||
| Solder Mask | |||
| Pad no Open | soldermask must cover all on both side, reject tin on pad  | ||
| Pad Open | reject soldermask inside the hole on both side  | ||
| Solder Mask Thickness | 0.7mil,raised H≤0.05  | ||
| Colour | green,blue,red,yellow,black,white(LPI/MATT.,UL 94 V0 approved) | ||
| Surface Finish | |||
| HAL | tin height≤0.05mm  | ||
| ENIG | Nickel 3-7um,gold:0.5-0.7um | ||
| OSP/flash gold | 0.2-0.5um | ||
| Pealable mask | cover all on pad,thickness≥0.20mm  | ||
| Carbon Ink | cover all on trace,Value≤30Ω  | ||
| Outline | |||
| Outline Tolerance | ±0.2mm | ||
| Beveling | 30°,45° | ||
| V-cut position/depth | ±0.2mm(length≤100mm)/±0.2mm | ||
| Punch | ±0.1mm | ||
| E-testing pass percent | 97% pass for the first time,+/-2%(tolerance) | ||
| Certificate | SGS,ISO,ROHS,UL, | ||


 
  
  
  
  
  
  
  
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